MITSUBISHI MATERIALS CORPORATION
BACK

CERMET

  • The optimized alloy structure and special alloy binder improves both wear and fracture resistance.
  • It covers a wide application range and reduces the number of tools required.
  • NX3035 for wet cutting.
  • NX2525 for dry cutting.
Micro-Structure of NX2525
Micro-Structure of NX3035
NX3035 uses a special alloy substrate in the metal binder phase to deliver highly improved thermal shock resistance.

Micro-Structure of NX2525
Micro-Structure of NX2525
NX2525 has high hardened Ti compound particles within it's microstructure therefore the grade has both excellent wear and fracture resistance properties.

SELECTION STANDARD
TURNING
TURNING

CUTTING PERFORMANCE
CUTTING PERFORMANCE
GRADE CHARACTERISTICS
Grade Substrate
Hardness (HRA) T.R.S(GPa) Thermal Conductivity
(W/m·K)*
Thermal Expansion
(x 10-6/K)
NX2525 92.2 2.0 33 7.8
NX55 91.7 1.8 25 7.8
NX99 91.2 1.9 33 7.8
* 1GPa=102kg/mm2, 1W/m · K=2.39 x 10-3cal/cm · sec · °C