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| Micro-Strunture of NX2525 | Micro-Strunture of NX4545 |
| GRADE CHARACTERISTICS |
| Grade | Substrate | |||
| Hardness (HRA) |
T.R.S.(GPa) | Thermal Conductivity (W/m·K)* |
Thermal Expansion (X10-6/K) |
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| NX1010 | 92.7 | 1.8 | 3.3 | 7.7 |
| NX2525 | 92.2 | 2.0 | 3.3 | 7.8 |
| NX55 | 91.7 | 1.8 | 3.3 | 7.8 |
| NX99 | 91.2 | 1.9 | 3.3 | 7.8 |
| NX335 | 91.2 | 1.9 | 3.3 | 7.8 |
| NX4545 | 90.0 | 2.2 | 3.3 | 7.8 |
| *1GPa=102kg/mm2,1W/m·K=2.39X10-3cal/cm·sec·°C |
| SELECTION STANDARD |
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| CUTTING PERFORMANCE |
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